Thursday, November 10, 2011

3D ICs Have a History

Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging | EDA360 Insider is a great quick history (with pictures!) of 3-dimensional chips (actually, going back to the vacuum tube days).

Practical takeaway: stacked memory is clearly one of the killer apps for 21st-century 3D IC assembly.

No comments: