I wish I had gone to the
ARM Technology Conference. Lots of good design topics, and some
long-range prognostication such as
IBM Speaker Outlines Path to 22nm and Beyond.
This blog post by Richard Goering of Cadence summarizes a talk by a VP of IBM's semiconductor research center.
For 22nm, they main change appears to be more "lithography tricks".
Richard includes a link about "double patterning".
Beyond 22nm, many things get exotic.
Extreme UV (EUV) has been the next big lithography change for ages -- is it finally required for 15nm?
FINFETS, Carbon Nanotubes, and Stacked Die, Oh My!
We're not in Kansas any more.
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